iPhone Repair Term
Reballing
Replacing all solder balls on a BGA chip with fresh ones
Reballing is the process of removing all solder balls from a BGA chip and replacing them with a fresh set. It is performed when solder connections have cracked or corroded but the chip itself is still functional. The chip is removed using hot air, cleaned, a fresh solder stencil applied, new balls reflowed, and the chip reinstalled. Common after water damage or thermal stress.
Why It Matters For Your Repair
Reballing restores a chip that would otherwise be discarded, saving the cost of a new chip and preserving data. It is especially relevant after water damage, where solder joints corrode but chips remain intact. Requires the same specialist BGA equipment as microsoldering — not all repair shops can perform this correctly.
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