iPhone Repair Term
BGA
Ball Grid Array — how chips connect to the iPhone logic board
BGA (Ball Grid Array) is a chip packaging method where all electrical connections are made through an array of tiny solder balls on the underside of the chip — invisible once assembled. Used for the Apple A-series CPU, RAM chips, Power ICs, and all major controller chips on iPhone logic boards. BGA chips cannot be replaced with a standard iron — hot air rework equipment and a stereo microscope are required.
Why It Matters For Your Repair
When an iPhone chip fails, it is almost certainly a BGA component. This is why board-level repair requires a proper microsoldering specialist — not just any technician. Always confirm your repair shop has BGA-capable equipment (hot air station, stencils, stereo microscope) before trusting them with a logic board repair.
Related Terms
iPhone chip-level fault?
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