Samsung Repair Term
Reballing
Replacing all solder balls on a BGA chip with fresh ones
Reballing is the process of removing all solder balls from a BGA chip and replacing them with a fresh set. It is required when the existing solder connections have cracked or corroded but the chip itself is still functional. The chip is removed, cleaned, a new solder stencil is applied, and fresh solder balls are reflowed. The chip is then reinstalled on the logic board.
Why It Matters For Your Repair
Reballing is used when a chip has good connections but the solder joints beneath it have failed — common after water damage or thermal stress. It restores a chip that would otherwise be discarded. It requires the same specialist equipment as BGA work: hot air station, stencil, and microscope.
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